Thunder II – 8 channel, 16 bit, 250Mhz digital-to-analog converter board

Thunder LogoThe 3DR-A10-DAC-12.6 GSPS is an eight channel, 16 bit, 250Mhz digital-to-analog converter board used to convert digital signals into analog waveforms. The on-board Intel Arria 10 FPGA (10AX115U3F45E2SG) can be used to digitally generate waveforms or playback pre-stored samples. As with all 3DR computing modules, the 3DR-A10-DAC-12.6 GSPS supports three-dimensional connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.

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Description

The 3DR-A10-DAC-12.6 GSPS is an eight channel, 16 bit, 250Mhz digital-to-analog converter board used to convert digital signals into analog waveforms. The on-board Intel Arria 10 FPGA (10AX115U3F45E2SG) can be used to digitally generate wave-forms or playback pre-stored samples. As with all 3DR computing modules, the 3DR-A10-DAC-12.6 GSPS supports three-dimensional connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements. The 3DR-A10-DAC-12.6 GSPS also offers additional external interface via SMA for tailored clocking and control signal flexibility. The 3DR computing standard microcontroller architecture is interfaced through the I2C bus to provide FPGA temperature, voltage, and current monitoring for automatic shut-down during critical over heat and/or voltage conditions.

3DR computing technology brings together high performance computing, ease of programmability, low-cost, and commercial I/O flexibility in a modular, open systems and standards architecture to realize uniquely scalable and widely configurable, high speed embedded processing solutions for the development of radar, electronic warfare (EW), signal intelligence (SIGINT), and communication systems. 3DR computing possesses the unique ability to morph in size, shape, and processing capacity. This flexibility provides a low cost, standard solution capable of rapidly conforming to the vastly different power, space, and environmental requirements found aboard any surface, sub-surface, or airborne system or platform.

Applications

  • General purpose/digital signal processing
  • Radar exciters and Digital Waveform Generation (DWG)
  • EW/attack systems
  • SIGINT (ELINT, COMINT, etc. ) systems

Features

FPGA

  • Intel Arria 10
  • 10AX115U3F45E2SG
  • Flash memory for up to two FPGA configurations
  • JTAG programmable
  • 2 NOR Flash configuration/user programmable memories (master BPI
    configuration, write protects available)

Digital-to-Analog Conversion

  • 8 channel
  • 16-bit

External I/O Support available via

  • Y-connector (2x)
  • Z-connector (1x)
  • Digital connectors for FPGA direct connection (4x, 100pin)
  • JTAG

Clocking and Triggering Flexibility

  • Clock input (SMA)
  • 1x programmable SMA (output)

Standard 3-D Computing

  • Microcontroller interface
  • K61 μ controller
  • Controls power-on and power-down sequencing
  • Monitors voltages and report faults over I2C bus
  • Monitors current, e-fuse shut-down, and reports over I2C bus
  • Monitors board temperature over I2C bus (external sensor available)
  • On board EEPROM for data storage and logging (write protect available)
  • FPGAs and CPLDs programmable over JTAG Bus (for applicable modules with FPGAs and CPLDs), or via connectors from other 3DR computing boards (firmware required)

Benefits

  • Enough FPGA Flash memory to hold two FPGA configurations
  • On board current limiting circuitry fuse and temperature monitoring for board protection
  • Standard 4-pin power

Specifications

DAC

  • 16 bit, 12.6 GSPS
  • 1×, 2×, 3×, 4×, 6×, and 8× configurable data channel interpolation
  • 1×, 2×, 4×, 6×, 8×, and 12× configurable final interpolation
  • Internal PLL
  • (2x) dual outputs
  • Drives 50 ohm load
  • 1.54 GSPS complex/channel
  • Final 48-bit NCO

Environmental

  • Operating temperature : 0° to 50°C (commercial configuration)
  • Storage temperature : (est) -55°C to 100°C, cooling airflow recommended, FPGA application dependent (heat sink mounts available)

Health Monitoring

  • Board Voltages
  • PCIe switch, FPGA
  • Two external temperature sensors
  • I2C a
  • Smoke detection
  • Impact detection

Clocking Options

  • On board oscillator
  • Off board SMA

Memory-DDR

  • 4 GB unbuffered

External Interfaces*

  • Y1, Connectors : PCIe & LVDS (FPGA)
  • Y2, Z2 Connectors: LVDS (FPGA)

*Connectors Y1, Y2, Z2 have PCIe, SerDes, and LVDS

Physical

  • Dimensions: 6.25”L x 6.25”W
  • Distance between board (stacked, board-to-board): 1.1”

Power

  • Power consumption: 12V @ 15.5 amps (subject to FPGA loading)
  • Supply options: 12V power cable
  • Additional power features: e-fuse/continuous power monitoring