Hurricane

Altera Arria 10, AMD APU

The 3DR-A10-GPGPU module follows the 3DR topology so it can be used in combination with other 3DR-compatible boards to add parallel processing power to a system. The AMD GE420CIAJ44HM APU can deliver nearly 32 GFLOPS single precision peak per TK1-SOM. The Arria 10 can deliver an additional 900 GFLOPS. A 2-link, 4 GB Hybrid Memory Cube (HMC) connects to the Field-Programmable Gate Array (FPGA) providing  an aggregate memory bandwidth of 120 GB/s. Offboard connectivity includes PCIe Gen3, low-voltage differential signaling (LVDS), and Serializer/Deserializer (SerDes) in all three dimensions as well as one GbE port (accelerated processor unit (APU)) and one 10/100 Ethernet (K61), JTAG, and USB-to-UART. The variety of available standard interfaces promotes network connectivity with a wide range of third party systems and subsystems. This includes commercially available switches and routers and promotes the integration of a system-of-systems in a net-centric environment

The 3DR standard microcontroller architecture is interfaced through the I2C bus to provide FPGA, APU, Graphics Processor Unit (GPU), and Peripheral Component Interconnect Express (PCIe) switch temperature as well as voltage and current monitoring for automatic shut-down during critical overheat and/or voltage conditions. As with all modules which follow the 3DR topology, the GPU module supports 3-D connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.

 

Files

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Description

Applications

  • Unmanned Aerial Systems/Unmanned Ground Systems (UAS/UGS)
  • Sensor and navigation processing
  • General purpose/Digital Signal Processing (DSP)
  • Radar receiver/exciter
  • Digital array processing & beamforming
  • Electronic warfare (EW)/attack systems
  • Signal Intelligence (SIGINT), electronic intelligence (ELINT), communications intelligence (COMINT), systems, etc.
  • Digital image processing

Features

  • GPU: Radeon E8860 discrete chip with 2 GB GDDR5 embedded memory. Capable of 768 GFLOPS with 640 shaders and 2 MB SPI booth flash.
  • APU: AMD GE420CIAJ44HM with quad core x86 2.0GHz CPU cores and integrated GPU cores with 4 GB DDR3 up to 1333 Mb/s with error correction code. Capable of 185 GFLOPS.
  • FPGA: Altera Arria 10, 10AX115U3F45I2SG with 2-link, 4 GB hybrid memory cube. Arria 10 capable of 900 GFLOPS.
  • Provides 3D connectivity via PCIe, LVDS, and SerDes with 214.2 GB/sec of bandwidth available per module.
  • Employs onboard current limiting circuitry and fused temperature monitoring chip.
  • Additional I/O support available via gigabit Ethernet, HTAG, and USB-to-UART.
  • Gigabit Ethernet (GbE) port support TCP/IP
  • Two mini-DisplayPort outputs available; supports mini DP++-to-HDMI dongle

Specifications

Microcontroller Interface

  • Controls power-on and power-down sequencing
  • Monitors voltages and reports faults over 12C bus
  • Monitors current, e-fuse shut-down, and reports over I2C bus
  • Monitors board, APU, GPU, FPGA, and PCIe switch temperature over I2C bus
  • On board Electrically Erasable Programmable Read-only Memory (EEPROM) for data storage and logging (write protect available)
  • FPGAs and Complex Programmable Logic Device (CPLD)s programmable over JTAG Bus (for applicable modules with FPGAs and CPLDs)

Power

  • Power Consumption: 12V @ 15 amps (subject to FPGA loading)
  • Supply options: 12V power cable
  • Additional power features: e-fuse/continuous power monitoring

*Contact CEI for available standard and tailored configurations, part numbers and ordering information.

Physical

  • Board dimensions: 6.25” L x 6.25” W
  • Dimensions with connectors: 6.668” L x 6.668” W
  • Distance between boards (stacked): 1.1″

General Characteristics

  • Processors: AMD GE420CIAj44HM (2.0 GHz Quad-Core)
  • DDR3: 4GB at 1333 MHz
  • Boot flash: 128 MB
  • GPU: AMD Radeon E8860 with 2 GB GDDR5 (at 1125 MHz)
  • FPGA: Altera Arria 10 10AX115U3F45I2SG
  • 3 NOR flash configuration/user programmable memories
  • JTAG programmable
  • 2-link HMC: 4 GB at 120 GB/s

Environmental

  • Operating temperature: 0° to +50°C
  • Storage temperature: (est) -40° to +85°C
  • Cooling: air flow recommended; FPGA application dependent
  • Relative humidity: 10-90% non-condensing
  • Shock/vibration: please contact CEI for configuration options

External Interfaces

  • 1 G Ethernet ports: 1
  • 10/100 Ethernet port: 1
  • PCI-e (Gen2 or Gen3)
  • X1, X2 Connectors: PCIe (switch); LVDS (FPGA); SerDes (FGPA)
  • Y1, Y2 Connectors: PCIe (switch); LVDS (FPGA); SerDes (FGPA)
  • Z1, Z2 Connectors: PCIe (switch); LVDS (FPGA); SerDes (FGPA)
  • USB-to-UART
  • USB-A 2.0
  • 2x Mini DisplayPort (DP++)
  • SMA (1in, 1out)