Crestone (3DR-S5-T4240)

At the heart of the 3DR family architecture is the 3DR-S5-T4240, aka Crestone, processor module. This module consists of a Power PC (Freescale T4240) general purpose and communications processor, an Altera Stratix V FPGA, on board DDR3 memory modules and a combination of PCIe Gen 3, LVDS, and SerDes commercially available I/O modules. The processing modules also provide dual 10G Ethernet ports, JTAG, and UART-over-USB. The variety of available standard interfaces promotes network connectivity with a wide range of third party systems and subsystems. This includes commercially available switches and routers and promotes the integration of a system-of-systems in a net-centric environment. The 3DR standard micro-controller architecture is interfaced through the I2C bus to provide FPGA and PPC temperature, voltage, current, and clock monitoring for automatic shut-down during critical over heat and/or voltage conditions. As with all 3DR modules, the 3DR-S5-T4240 board supports 3D connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight and power requirements.

3DR computing technology brings together high performance computing, ease of programmability, low-cost, and commercial I/O flexibility in a modular, open systems and standards architecture to realize uniquely scalable and widely configurable, high speed, embedded processing solutions for the development of radar, EW, SIGINT, and communication systems.

3DR computing possesses the unique ability to morph in size, shape, and processing capacity. This flexibility provides a low cost, standard solution capable of rapidly conforming to the vastly different power, space, and environmental requirements found aboard any surface, sub-surface, or airborne system or platform.


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  • General Purpose
  • Digital Signal Processing
  • Radar Receiver/Exciter
  • Digital Array Processing & Beamforming
  • Electronic Warfare/Attack Systems
  • Systems Digital Image Processing Remote Sensing


Altera Stratix V

  • 5SGSED8N1F45I2N
  • 864 Mb QDR-II+
  • LVDS
  • SerDes
  • PCIe Gen3

PLX PCIe 3D Mesh

  • 8000 MBps full duplex per connector
  • 1×8 or 2×4 per connector
  • 16000 MB/s in X connectors
  • 16000 MB/s in Y connectors
  • 16000 MB/s in Z connectors

Freescale T4240

  • 12 cores
  • 24 virtual cores
  • DDR3: 12GB DDR3@1600 MT/s (three memory controllers with 4GB each)
  • 2 – 10 GbE Ports
  • PCIe Gen 3

LVDS 3D Mesh

  • Two clusters of 7 LVDS per connector
  • 14 Gbps in X
  • 14 Gbps in Y
  • 14 Gbps in Z

Freescale K61

  • Controls power sequencing
  • Monitors temperatures
  • Monitors voltages
  • Monitors currents

SerDes 3D Mesh

  • x4 SerDes
  • 56 Gbps per connector
  • 56 Gbps in X connectors
  • 56 Gbps in Y connectors
  • 56 Gbps in Z connectors


General Characteristics

  • Processor: Freescale T4240 (1.8 GHz)
  • DDR3: 12GB DDR3@1600 MT/s (three memory controllers with 4GB each)
  • NAND Flash: 512MB
  • PPC local bus: up to 100MHz at 16 bits


  • Altera Stratix V 5SGSED6N3F45C4N up to 5SGSED8N1F4512N
  • JTAG programmable
  • Master BPI configuration
  • Write protect available
  • QDR-II+: 576MB at 450 MT/s


  • Operating temperature: 0°C to +50°C
  • Storage temperature: (est) -40°C to +105°C
  • Cooling: airflow recommended, FPGA application dependent
  • Relative humidity: 10% to 90% non condensing
  • Shock/Vibration: Please contact CEI for configuration options

External Interfaces

  • Two 10G Ethernet ports
  • Gen 3 PCIe (Single x8 or dual x4 per connector)
  • All X, Y, Z connectors: FPGA: SerDes, LVDS, PCIe / PPC: PCIe
  • RS-232: PPC
  • UART-over-USB: PPC, Microcontroller, FPGA


  • Power consumption: 12V @ 6 Amps (subject to FPGA loading)
  • Supply options: 12V power cable
  • Additional power features: e-fuse/continuous power monitoring


  • Board dimensions: 6.25″ L x 6.25″ W
  • Board dimensions including connectors: 6.6668″ L x 6.668″ W
  • Distance between boards (stacked, board-to-board): 0.990″
  • Weight: 12.2 oz