3DR Lightning IV – 10 Channel, 16 Bit, 160 MHz Analog-to-Digital Converter

Lightning LogoThe 3DR-V6-ADC-160MSPS, known as Lightning IV, is a 10 channel, 16 bit, 160MHz Analog-to-Digital converter board for digitizing and processing analog inputs. High performance, low latency processing can be implemented via the onboard VIRTEX–6 FPGA (XC6VLX240T). As with all 3DR computing modules, Lightning IV supports three dimensional connectivity, allowing the user to stack and/ or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.

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SKU: 3DR-V6-ADC-160MSPS Categories: , , , , Tags: , , ,

Description

The 3DR-V6-ADC-160MSPS, known as Lightning IV, is a 10 channel, 16 bit, 160MHz Analog-to-Digital converter board for digitizing and processing analog inputs. High performance, low latency processing can be implemented via the onboard VIRTEX–6 FPGA (XC6VLX240T). As with all 3DR computing modules, Lightning IV supports three dimensional connectivity, allowing the user to stack and/ or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.

Lightning IV provides PCIe and LVDS interfaces via the Y and Z connectors to other modules in the 3DR computing family. It also offers additional external interfaces including TwinAx, and SMA connections for clocking and triggering flexibility. Lightning IV standard microcontroller architecture is interfaced through the I2C bus to provide FPGA temperature, voltage, and current monitoring for automatic shut-down during critical over heat and/or voltage conditions.

3DR Computing technology brings together high performance computing, ease of programmability, low-cost, and commercial I/O flexibility in a modular, open systems and standards architecture to realize uniquely scalable and widely configurable, high speed embedded processing solutions for the development of radar, EW, SIGINT, and communication systems.

3DR Computing possesses the unique ability to morph in size, shape, and processing capacity. This flexibility provides a low cost, standard solution capable of rapidly conforming to the vastly different power, space, and environmental requirements found aboard any surface, sub-surface, or airborne system or platform.

Features

Product Benefits

  • Enough FPGA Flash Memory to hold two FPGA configurations
  • On board circuitry fuse and temperature monitoring for board protection
  • Standard 4-pin power connector

FPGA

  • Xilinx Virtex 6 (XC6VLX240T)
  • DDR Memory Module
  • Up to two FPGA configurations

I/O Support Available Via:

  • Y-Connector (2x)
  • Z-Connector (2x)
  • JTAG
  • DB29 connections

Analog-to-Digital Conversion

  • 10 Channel
  • 16-bit
  • 160MSPS
  • SNR 78dB
  • SFDR 95dB

Clocking and Triggering Flexibility

  • Sample Gates (SMA)
  • Trigger (SMA)
  • Clock Inputs (SMA/TwinAx)

Applications

  • Digital Signal Processing/Data Acquisition
  • Radar Receiver (Digital Receiver)
  • Digital Array Processing & Beamforming
  • Electronic Warfare/Attack Systems
  • Digital Image Processing
  • Remote Sensing

Specifications

Standard 3DR-V6-ADC-160MSPS Microcontroller Interface

  • Dual Microcontrollers Programmable over SPI bus
  • Controls Power-on and Power-down Sequencing
  • Monitors Voltages and Reports Faults over I2C Bus
  • Monitors Current, e-fuse shut-down, and reports over I2C Bus
  • Monitors board/chip temperature over I2C Bus (external user-defined sensor available)
  • On-board EEPROM for Data Storage and Logging (write protect available)
  • FPGAs and CPLDs Programmable over JTAG Bus (for applicable modules with FPGAs and CPLDs), or via Connectors from other 3DR Computing Boards (firmware required)

FPGA

  • Xilinx, Virtex 6XC6VLX240T
  • LX365T & LX550T Available in 1759 Package
  • JTAG Programmable
  • 2 NOR Flash Configuration/User Programmable Memories (Master BPI Configuration, write protects available)

DDR2

  • Up to 3GB

A/D

  • Texas Instruments ADC 6DV160 (2 channels/device)
  • 16 Bit, 160 MHz, 160 MSPS
  • Up to 10 Channels
  • DDR LVDS Output
  • +/- 1.1v PP Input, 50 Ohm Input Impedance

Power

  • Power Consumption (based on FPGA loading) 12V @2.0 Amps

Environmental

  • Operating Temperature: 0°C to 50°C (commercial configuration)
  • Storage Temperature: (est) -55°C to 100°C, Cooling Airflow Recommended, FPGA Application Dependent (heat sink mounts available)

Clocking Options

  • On-board Oscillator
  • Off-board SMA
  • Off-board TwinAx
  • Board-to-Board Y Connector
  • Board-to-Board Z Connector

External Interfaces

  • Y1, Z1 Connectors: LVDS (FPGA)
  • Y2, Z2 Connectors: PCIe & LVDS (FPGA)
  • A/D Channels; Up to 10 25-pin D-sub General Purpose I/O

Physical

  • Dimensions: 6.25″L x 6.25″W (including connectors: 6.668″L x 6.289″W)
  • Distance Between Boards (stacked, board-to-board): 1.1″
  • Weight: ~13 oz.