3DR-V6-460SX

DR Computing technology brings together high performance computing, ease of programmability, low cost, and commercial I/O flexibility in a modular, open systems and standards architecture to realize uniquely scalable and widely configurable, high speed embedded processing solutions for the development of radar, EW, SIGINT, and communication systems.

3DR Computing possesses the unique ability to morph in size, shape, and processing capacity. This flexibility provides a low cost standard solution capable of rapidly conforming to the vastly different power, space, and environmental requirements found aboard any surface, sub-surface, or airborne system or platform.

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Description

At the heart of the 3DR Computing family architecture is the 3DR-V6-460SX Central Processing Module. This module consists of a Power PC (PPC-460SX) general purpose processor, a Xilinx (Virtex 6) FPGA, on board DDR2 memory modules, and a combination of PCIe, LVDS, and SERDES commercially available I/O modules. The processing modules also provide dual Gigabit Ethernet ports, JTAG, and RS-232. The variety of available standard interfaces promotes network connectivity with a wide range of 3rd party systems and subsystem. This includes commercially available switches and routers and promotes the integration of a system-of-systems in a net-centric environment.

The 3DR Computing standard micro-controller architecture is interfaced through the I2C bus to provide FPGA and PPC temperature, voltage, and current monitoring for automatic shut-down during critical over heat and/or voltage conditions.

As with all 3DR Computing modules, the 3DR-V6-460SX supports 3 dimensional connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.

Applications

  • General Purpose/Digital Signal Processing
  • Radar Receiver/Exciter
  • Digital Array Processing and Beamforming
  • Electronic Warfare/Attack Systems
  • SIGINT (ELINT, COMINT, Etc.) Systems
  • Digital Image Processing
  • Remote Sensing

Features

Product Benefits

  • Employs onboard current limiting circuitry and fused temperature monitoring chip
  • Additional I/O support available via dual Gigabit Ethernet ports, JTAG, and standard RS-232 connections
  • Dual Gigabit Ethernet ports support TCP/IP
  • Power supplied via standard 4-pin power connector

Power PC

  • PPC-460SX (800MHz to 1.2 GHz)
  • Up to 4GB DDR2 memory at 800MHz
  • 64MB Boot Flash
  • 512 MB NAND Flash

FPGA

  • Xilinx Virtex 6 (XC6VLX240T)
  • DDR2 memory
  • Up to 533MHz supporting sizes
  • Up to 4GB at various speeds

3D Connectivity Via:

  • PCIe
  • LVDS
  • SerDes
  • 39 GB/sec of bandwidth per module

Specifications

Standard 3DR-V6-460SX Microcontroller Interface

  • Dual Microcontrollers Programmable over SPI bus
  • Controls Power-on and Power-down Sequencing
  • Monitors Voltages and Reports faults over I2C bus
  • Monitors Current, e-fuse shut-down, and reports over I2C bus
  • Monitors board temperature over I2C bus (external sensor available)
  • On board EEPROM for data storage and logging (write protect available)
  • Two RS-232 debug ports
  • FPGAs and CPLDs programmable over JTAG Bus (for applicable modules with FPGAs and CPLDs)

Power

  • Power Consumption: 12V @ 3.8 Amps (Subject to FPGA loading)
  • Supply Options: 12V Power Cable
  • Additional Power Features: e-fuse/continuous power monitoring

Processor

  • AMCC PPC460SX (1.0 GHz)
  • DDR2 —> 2GB (up to 4GB) at 800 MHz
  • PPC Boot Flash —> 64MB
  • NAND Flash —> 512MB
  • PPC Local Bus —> up to 100 MHz at 32 bits

FPGA

  • Xilinx, Virtex 6 XC6VLX240T
  • LX365T & LX550T available in 1759 package
  • 2 Nor Flash Configuration/User Programmable Memories
  • JTAG Programmable
  • Master BPI Configuration
  • Write Protects Available

Environmental

  • Operating Temperature: 0°C – 50°C
  • Storage Termperature: (est) -40°C to 85°C
  • Cooling: Airflow recommended; FPGA dependent
  • Relative Humidity: 10-90% non condensing
  • Shock/Vibration: Please contact CEI for Configuration

Physical

  • Board dimensions: 6.25″L x 6.25″W
  • Dimensions including connectors: 6.668″L x 6.668″W
  • Distance between boards (Stacked, Board-to-Board): 1.1″
  • Weight: 11 oz

External Interfaces

  • Two 1G Ethernet ports
  • Ethernet Hardware Acceleration —> TCP/IP built into PPC with support for Jumbo Frames
  • Ethernet Performance —> 840 Mb/s (with HW acceleration)
  • Gen1 or Gen2 PCIe
  • X1, X2 Connectors —> PCIe (FPGA/PPC); LVDS (FPGA)
  • Y1, Y2 Connectors —> PCIe (PPC); LVDS (FPGA)
  • Z1, Z1 Connectors —> PCIe (FPGA/PPC); LVDS (FPGA)
  • Z3, Z4 Connectors —> SERDES (FPGA)
  • USB 2.0
  • RS-232