3DR-S5-T4240

At the heart of the 3DR family architecture is the 3DR-S5-T4240 Processor Module. This module consists of a Power PC (Freescale T4240) general purpose and communications processor, an Altera Stratix V FPGA, on board DDR3 memory modules and a combination of PCIe Gen 3, LVDS, and SERDES commercially available I/O modules. The processing modules also provide dual 10G Ethernet ports, JTAG, and UART-over-USB. The variety of available standard interfaces promotes network connectivity with a wide range of 3rd party systems and subsystems. This includes commercially available switches and routers and promotes the integration of a system-of-systems in a net-centric environment. The 3DR standard micro-controller architecture is interfaced through the I2C bus to provide FPGA and PPC temperature, voltage, current, and clock monitoring for automatic shut-down during critical over heat and/or voltage conditions. As with all 3DR modules, the 3DR-S5-T4240 board supports 3D connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight and power requirements.

Files

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Description

Applications

  • General Purpose
  • Digital Signal Processing
  • Radar Receiver/Exciter
  • Digital Array Processing & Beamforming
  • Electronic Warfare/Attack Systems
  • SIGINT (ELINT, COMINT, etc.)
  • Systems Digital Image Processing Remote Sensing

Features

Altera Stratix V

  • 5SGSED8N1F45I2N
  • 864 Mb QDR-II+
  • LVDS
  • SerDes
  • PCIe Gen3

PLX PCIe 3D Mesh

  • 8000 MBps Full Duplex Per Connector
  • 1×8 or 2×4 per Connector
  • 16000 MB/s in X Connectors
  • 16000 MB/s in Y Connectors
  • 16000 MB/s in Z Connectors

Freescale T4240

  • 12 Cores
  • 24 Virtual Cores
  • DDR3: 12GB DDR3@1600 MT/s (3 Memory Controllers with 4GB each)
  • 2 – 10 GbE Ports
  • PCIe Gen 3

LVDS 3D Mesh

  • 2 Clusters of 7 LVDS Per Connector
  • 14 Gbps in X
  • 14 Gbps in Y
  • 14 Gbps in Z

Freescale K61

  • Controls Power Sequencing
  • Monitors Temperatures
  • Monitors Voltages
  • Monitors Currents

SerDes 3D Mesh

  • x4 SerDes
  • 56 Gbps Per Connector
  • 56 Gbps in X Connectors
  • 56 Gbps in Y Connectors
  • 56 Gbps in Z Connectors

Specifications

General Characteristics

  • Processor: Freescale T4240 (1.8 GHz)
  • DDR3: 12GB DDR3@1600 MT/s (3 Memory Controllers with 4GB each)
  • NAND Flash: 512MB
  • PPC Local Bus: up to 100MHz at 16 bits

FPGA

  • Altera Stratix V 5SGSED6N3F45C4N up to 5SGSED8N1F4512N
  • JTAG Programmable
  • Master BPI Configuration
  • Write Protects Available
  • QDR-II+: 576MB at 450 MT/s

Environmental

  • Operating Temperature: 0°C to +50°C
  • Storage Temperature: (est) -40°C to +105°C
  • Cooling: airflow recommended, FPGA application dependent
  • Relative Humidity: 10% to 90% non condensing
  • Shock/Vibration: Please contact CEI for configuration options

External Interfaces

  • Two 10G Ethernet ports
  • Gen 3 PCIe (Single x8 or dual x4 per connector)
  • All X, Y, Z Connectors: FPGA: SERDES, LVDS, PCIe / PPC: PCIe
  • RS-232: PPC
  • UART-over-USB: PPC, Microcontroller, FPGA

Power

  • Power Consumption: 12V @ 6 Amps (Subject to FPGA Loading)
  • Supply Options: 12V Power Cable
  • Additional Power Features: e-fuse/continuous power monitoring

Physical

  • Board dimensions: 6.25″ L x 6.25″ W
  • Board dimensions including connectors: 6.6668″ L x 6.668″ W
  • Distance Between Boards (Stacked, Board-to-Board): 0.990″
  • Weight: 12.2 oz